As semiconductor technology advances, new requirements have evolved with regards to the wafer storage environment throughout the production process. N2 Purging protects wafers from the harmful effects of oxygen, water vapor and gaseous contaminants. The high purity purging systems are designed to meet SEMI standards and are available as "Standalone" units or "Fully Integrated" into Stockers with full communication with AMHS and OHV systems.

The Technology Challenge 

Semiconductor manufacturing processes often leave the processed wafer expossed to corrosion and/or adsorption of ambient gasses.
These gasses may corrode or change the electrical and mechanical properties of previous layers resulting to device failure.
 

Here are a few examples to demonsrate:

In Front-End of line, the presence of   In Black-End of line, diffusion of
humidity and oxygen in an enclosed    water vapor with etch process
environment in contact with wafers    gases can increase k value LK
 can cause various phenomena such   materials. Oxidation between
as native oxide growth, corrosion,      Copper  seed and copper
and film cracking.                            electroplating may cause
                                                   corrosion and poor  
                                                   conducttivity.